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Analysis of Resistive-Open Defects in SRAM Sense Amplifiers

机译:SRAM读出放大器的电阻开路缺陷分析

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Figures 3 and 6 (are/contain) unreadable data. In this paper, we present an exhaustive analysis of resistive-open defects in sense amplifiers of static random access memory designed with a 65 nm technology. We show that some resistive-open defects may lead to a new type of dynamic behavior that has never been experienced in the past. It is modeled by dynamic two-cell incorrect read faults of two different types. Such fault models represent failures in the sense amplifier, which prevent it from performing any read operations (in case of type 1 ) or only a single type of read operation (in case of type 2). Results of electrical simulations are presented to provide a complete understanding of such a faulty behavior and possible March test solutions are proposed to detect all d2cIRFs.
机译:图3和6(是/包含)不可读数据。在本文中,我们对采用65 nm技术设计的静态随机存取存储器的读出放大器中的电阻性开路缺陷进行了详尽的分析。我们表明,某些电阻性开路缺陷可能会导致一种过去从未经历过的新型动态行为。它是通过两种不同类型的动态两单元错误读取错误来建模的。此类故障模型表示感测放大器中的故障,这会阻止其执行任何读取操作(在类型1的情况下)或仅执行一种读取操作的类型(在类型2的情况下)。给出了电气仿真结果,以提供对这种故障行为的完整理解,并提出了可能的March测试解决方案来检测所有d2cIRF。

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