Tearing algebraic loops in bond graphs

摘要

For bond graphs with causal paths between resistive ports the mathematical model is a set of Differential Algebraic Equations. Depending on the purpose of the model, and the available software, there are different options to process algebraic constraints. A bond-graph-based approach is proposed that exploits tearing. By inserting special sinks into causal paths, indication is provided to the model processor as to which variables could be used as tearing variables, and which equations for their determination. An algorithm is proposed that identifies suitable locations for those sinks in the bond graph such that the number of tearing variables is small. It is shown how the approach can be applied to bond graphs with causal paths between stores as well.