Numerical analysis of deformation and thermal behavior during ultrasonic Al ribbon bonding

摘要

The ultrasonic bonding of Al ribbon is necessary for power electronics packaging technologies. The temperature rise and plastic deformation during the ultrasonic bonding were simulated. The temperature distribution and stress distribution were visualized. The main results are as follows; 1. A1 ribbon heats up to about 373 K, if the ultrasonic power is less than 4W. 2. Insulating or heating of the bonding tool is effective for heating Al ribbon. 3. Large stress is not obtained under the free slip condition, i.e., the large compression of Al ribbon cannot be produced.