Stiffness change with temperature in glass fiber reinforced composite laminates embedded with SMA wires

摘要

This paper discusses change in stiffnesses with temperature of composite laminates in which Ti- Ni shape memory wires are embedded. Young's modulus in Shape Memory Alloys (SMA)markedly increases with temperature passing through its phase transition temperature. GF laminate embedded with SMA wires can therefore increase its stiffnesses with temperature. The inplane stiffnesses of UD laminates with SMA wires are measured, and it is shown that the SMA does have influences on all inplane elastic coefficients.