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机译:多种部分涂层覆盖圆形板谐振器轴对称振动热弹性阻尼的广义方法
Southeast Univ Sch Mech Engn Nanjing 211189 Peoples R China;
Southeast Univ Sch Mech Engn Nanjing 211189 Peoples R China;
Nanjing Univ Posts & Telecommun Coll Elect & Opt Engn Nanjing 210003 Peoples R China|Nanjing Univ Posts & Telecommun Coll Microelect Nanjing 210003 Peoples R China|Nanjing Univ Posts & Telecommun Natl & Local Joint Engn Lab RF Integrat & Microas Nanjing 210003 Peoples R China;
Southeast Univ Sch Mech Engn Nanjing 211189 Peoples R China;
Thermoelastic damping; Partially covered circular bilayer plate; Green's function; Heat conduction; Thermoelasticity;
机译:基于轴对称和非轴对称振动的圆形板谐振器热弹性阻尼有限质量因子和临界尺寸分析
机译:叠层三层圆板谐振器轴对称振动的热弹性阻尼
机译:微型圆形薄板谐振器轴对称振动中热弹性阻尼的非线性分析
机译:叠层三层圆板谐振器轴对称振动的热弹性阻尼
机译:MEMS谐振器中的能量耗散:挠曲谐振器的流体阻尼和热弹性阻尼。
机译:微管谐振器面内振动中的熵生成和热弹性阻尼
机译:基于轴对称和非轴对称振动的圆形板谐振器热弹性阻尼有限质量因子和临界尺寸分析