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CoPt/Ag(Cu) nanocomposite films for ultra-high density perpendicular magnetic recording media

机译:用于超高密度垂直磁记录介质的CoPt / Ag(Cu)纳米复合膜

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CoPt/Ag nanocomposite films have been prepared by magnetron sputtering and subsequent annealing. The effect of Ag on the structure and magnetic properties of CoPt/Ag nanocomposite films was investigated. It was found that the existence of the Ag plays a dominant role in inducing the (001) texture of the film. (001) textured CoPt/Ag nanocomposite films with a large perpendicular coercivity in the range of 5.6-7.0 kOe have been achieved after annealing at 600℃. The Cu additive is very effective to reduce the ordering temperature in CoPtAg system. With Cu additive, the CoPtCuAg films start ordering at a lower annealing temperature of 450℃, which is lower by 150℃ than the pure CoPtAg films.
机译:CoPt / Ag纳米复合膜已通过磁控溅射和随后的退火工艺制备。研究了Ag对CoPt / Ag纳米复合薄膜结构和磁性的影响。发现Ag的存在在诱导膜的(001)织构中起主要作用。 (001)在600℃下退火后,已经获得了具有大的垂直矫顽力在5.6-7.0kOe范围内的织构化的CoPt / Ag纳米复合膜。铜添加剂对于降低CoPtAg系统中的有序温度非常有效。使用铜添加剂,CoPtCuAg薄膜在450℃的较低退火温度下开始有序化,该退火温度比纯CoPtAg薄膜低150℃。

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