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A Silicon Chip-Based Waveguide Directional Coupler for Terahertz Applications

机译:基于硅芯片的波导定向耦合器,用于太赫兹应用

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摘要

We propose a waveguide directional coupler design with weak coupling using silicon-based suspended coupling microstrip probes and the split-block type of construction common in integrated millimeter wave components. WR4.0 coupler prototypes with standard UG-387 flanges were fabricated and measured. The simulation and measurement results show that this design achieves a coupling of around-18 dB, with a typical +/- 2-dB variation across the band from 210 to 270 GHz, while the isolation is better than 30 dB. Tolerance studies confirm that this design could be scaled up to terahertz frequency with modern computer numerical control (CNC) machining and silicon chip fabrication technology.
机译:我们提出了一种具有弱耦合的波导定向耦合器设计,其使用基于硅基悬挂的耦合微带探针和集成毫米波部件中共同的分裂块型结构。使用标准UG-387凸缘的WR4.0耦合器原型进行制造和测量。仿真和测量结果表明,该设计实现了约18 dB的耦合,横跨210至270GHz的典型+/- 2-DB变化,而隔离优于30dB。公差研究证实,可以使用现代计算机数控(CNC)加工和硅芯片制造技术来扩大到太赫兹频率的缩放。

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