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首页> 外文期刊>Technology analysis & strategic management >Co-creation as a risk-sharing strategy for the development of innovative EUV lithography technology in the semiconductor industry
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Co-creation as a risk-sharing strategy for the development of innovative EUV lithography technology in the semiconductor industry

机译:共创是半导体行业中创新EUV光刻技术发展的风险分担策略

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摘要

Co-creation is becoming an innovative way for new technology development (NTD). We propose a four-staged co-creation model drawn upon a backdrop of 'knowledge cloud' for value creation and long-term customer commitment resulting in risk-sharing associated with NTD. The model is elaborated through the case of a leading semiconductor lithography equipment manufacturer (ASML) developing a new extreme ultraviolet lithography technology by engaging the major stakeholders in customer co-investment programme. The model is generic and applicable to any technology-driven industry and may include more stakeholders of same or allied technology.
机译:共创正在成为新技术开发(NTD)的创新方式。我们建议在“知识云”的背景下绘制一个四阶段的共创模型,以实现价值创造和长期客户承诺,从而导致与NTD相关的风险共担。该模型是通过一家领先的半导体光刻设备制造商(ASML)通过使主要利益相关者参与客户共同投资计划来开发新的极紫外光刻技术的案例而得到完善的。该模型是通用的,适用于任何技术驱动的行业,并且可能包含更多相同或联合技术的利益相关者。

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