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Study on fabrication and cutting performance of high quality diamond coated PCB milling tools with complicated geometries

机译:复杂几何形状的高品质金刚石涂层PCB铣刀的制造和切削性能研究

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摘要

The diamond film was deposited on a complex shaped WC-Co printed circuit board (PCB) milling tool in a revised hot filament chemical vapour deposition apparatus, in which the vertical spiral hot filament arrangement was adopted. The SEM investigation on the surface of the fabricated diamond coated PCB milling tool exhibited a continuous layer of fine grained diamond films, with grain size of about 2-3 μm, was uniformly deposited. To evaluate the cutting performance of the fabricated diamond coated tool, comparative milling tests were conducted for both diamond coated and uncoated WC-Co PCB milling tools, with glass fibre reinforced composite materials as the workpiece. The milling test results showed that the flank wear on circle and end cutting edge of the fabricated diamond coated PCB milling tool were only 0·08 and 0·18 mm respectively after 40 min milling, about one-fifth and a quarter of that for uncoated WC-Co PCB milling tool, which could attribute to both the good wear resistance of the deposited diamond coating and the strong adhesion between them and the tool surface. Additionally, the thrust forces acted on the milling tools during the milling process were measured using a Kistler dynamometer measuring system. The results presented that all measured axial, radial and tangential thrust forces were smaller for diamond coated PCB milling tool, which was due to the low friction coefficient of the diamond film that could facilitate the chip evacuation.
机译:将金刚石膜沉积在改型的热丝化学气相沉积设备中的复杂形状的WC-Co印刷电路板(PCB)研磨工具上,其中采用了垂直螺旋热丝排列。在所制造的金刚石涂覆的PCB铣削工具的表面上的SEM研究显示出连续沉积了细晶粒金刚石膜的连续层,其晶粒尺寸为约2-3μm。为了评估所制造的金刚石涂层刀具的切削性能,以玻璃纤维增​​强复合材料为工件,对金刚石涂层和未涂层​​的WC-Co PCB铣刀进行了对比铣削测试。铣削测试结果表明,经过加工的金刚石涂层的PCB​​铣削刀具,在铣削40分钟后,其圆角和端面切削刃的侧面磨损分别仅为0·08和0·18 mm,约为未涂层的五分之一和四分之一WC-Co PCB铣刀,可以归因于沉积的金刚石涂层的良好耐磨性以及它们与刀具表面之间的牢固附着力。此外,使用Kistler测力计测量系统测量了铣削过程中作用在铣削工具上的推力。结果表明,对于金刚石涂层的PCB​​铣刀,所有测得的轴向,径向和切向推力都较小,这是由于金刚石膜的摩擦系数低,可以促进切屑的排空。

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