首页> 外文期刊>OR Spectrum >Modeling strategic semiconductor assembly outsourcing decisions based on empirical settings
【24h】

Modeling strategic semiconductor assembly outsourcing decisions based on empirical settings

机译:根据经验设置为战略性半导体组装外包决策建模

获取原文
获取原文并翻译 | 示例
       

摘要

In semiconductor supply chains, most chip makers focus on core competence of wafer fabrication and utilize assembly outsourcing to reduce operational costs, enhance capital-effectiveness of investments, and diversify the risks among the vendors. Assembly outsourcing decisions involve strategic partnerships with vendors and operational excellence for order allocations subject to production constraints, cost, delivery, and quality. This study aims to develop a decision framework in which preference over vendors at strategic level and order allocations at operational level can be integrated. Focusing on real setting in a semiconductor company, a decision support system embedded with proposed models was developed to evaluate vendor performance, allocate the orders, and generate the associated material requirement planning reports. The results showed practical viability of the proposed framework for modeling manufacturing strategy with the integration of optimized operational decisions.
机译:在半导体供应链中,大多数芯片制造商专注于晶圆制造的核心竞争力,并利用组装外包来降低运营成本,提高投资的资本效益并分散供应商之间的风险。组装外包决策涉及与供应商的战略合作伙伴关系以及卓越的运营,以根据生产限制,成本,交付和质量来分配订单。这项研究旨在建立一个决策框架,在该框架中可以整合对战略级供应商的偏好和运营级的订单分配。着眼于半导体公司的实际环境,开发了嵌入了建议模型的决策支持系统,以评估供应商的绩效,分配订单并生成相关的物料需求计划报告。结果表明,通过优化操作决策的集成,所提出的用于制造策略建模的框架具有可行性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号