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Designing the first microprossor

机译:设计第一个微处理器

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摘要

We now routinely buy personal computers in which microprocessors with millions of transistors perform at gigahertz speeds, so it is easy to forget that the first microprocessor was not a simple or obvious choice to produce. At the time it was being contemplated, metal oxide semiconductor (MOS) technology was still quite new, and integrated circuits themselves had existed less than a decade. While MOS circuits with a thousand transistors were being manufactured, the economics of integrated circuits of that day limited how far the technology could be pushed. A 2-in-diameter silicon wafer, costing perhaps US$50 to process, might have a 10% yield for a 0.02-in2 die. If we pushed the die size higher, there would be fewer potential die per wafer, and yield would fall precipitously. Table 1 shows how the die cost might vary with die size.
机译:现在,我们通常购买具有数百万个晶体管的微处理器以千兆赫兹速度运行的个人计算机,因此很容易忘记第一个微处理器并不是简单或明显的生产选择。在考虑的时候,金属氧化物半导体(MOS)技术仍然很新,集成电路本身的存在还不到十年。当制造具有一千个晶体管的MOS电路时,那天集成电路的经济性限制了该技术可以推广到什么程度。直径为2英寸的硅晶片的加工成本可能为50美元,而0.02英寸2的裸片的成品率可能为10%。如果我们将芯片尺寸推高,则每个晶片的潜在芯片数量将减少,而成品率将急剧下降。表1显示了管芯成本如何随管芯尺寸而变化。

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  • 来源
    《Solid-State Circuits Magazine, IEEE》 |2009年第1期|p.22-28|共7页
  • 作者

    Hoff M.E.;

  • 作者单位

    Teklicon Inc., Mountain View, CA, USA;

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  • 原文格式 PDF
  • 正文语种 eng
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  • 入库时间 2022-08-17 13:47:06

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