Ultra-Short-Reach Interconnects for Die-to-Die Links: Global Bandwidth Demands in Microcosm

Behzad Dehlaghi; Nijwm Wary; Tony Chan Carusone

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Ultra-Short-Reach Interconnects for Die-to-Die Links: Global Bandwidth Demands in Microcosm

机译：芯片对芯片链接的超短距离互连：微观世界中的全球带宽需求

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To meet the ever-increasing demand of global data traffic, the Hybrid Memory Cube (HMC) specification and High-Bandwidth Memory standard call for an aggregate bandwidth of 8 Tb/s in next-generation memory-to-processor links [1], [2]. At the same time, the

机译：为了满足全球数据流量不断增长的需求，混合内存多维数据集（HMC）规范和高带宽内存标准要求在下一代内存到处理器的链路中，总带宽为8 Tb / s [1]， [2]。同时，

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来源
《Solid-State Circuits Magazine, IEEE》 |2019年第2期|42-53|共12页
作者
Behzad Dehlaghi; Nijwm Wary; Tony Chan Carusone;
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作者单位

Huawei Canada Canada;

University of Toronto Canada;

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原文格式 PDF
正文语种 eng
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关键词
Substrates; Power demand; Packaging; Bandwidth; Data centers; Next generation networking; Integrated circuit interconnections; Channel estimation;

机译：基材;电力需求;打包;带宽;数据中心;下一代网络集成电路互连;频道估算;
入库时间 2022-08-18 04:32:49

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Ultra-Short-Reach Interconnects for Die-to-Die Links: Global Bandwidth Demands in Microcosm

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