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首页> 外文期刊>IEEE Journal of Solid-State Circuits >Applications for GaAs and silicon integrated circuits in next generation wireless communication systems
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Applications for GaAs and silicon integrated circuits in next generation wireless communication systems

机译:GaAs和硅集成电路在下一代无线通信系统中的应用

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摘要

Emerging applications for portable wireless voice and data communications systems are requiring increased data rates and functionality. Meeting cost and performance goals requires careful attention to system level design and partitioning such that appropriate technologies are employed in cost-effective solutions. New circuit designs and techniques are required to meet size, power, and regulatory restrictions. This provides an exciting opportunity for GaAs, silicon, and passive component technologies. This review paper will discuss factors influencing the choice of which technology is best suited to a particular application and present several system level architectures of radio-based communication systems. The paper will illustrate appropriate applications of GaAs, silicon, and passive integrated circuit technologies. A summary is given that highlights the relative strengths and weaknesses of each technology to date.
机译:便携式无线语音和数据通信系统的新兴应用要求提高数据速率和功能。为了达到成本和性能目标,需要仔细注意系统级设计和分区,以便在具有成本效益的解决方案中采用适当的技术。需要新的电路设计和技术来满足尺寸,功率和法规限制。这为GaAs,硅和无源组件技术提供了令人兴奋的机会。本文将讨论影响哪种技术最适合特定应用的选择的因素,并介绍几种基于无线电的通信系统的系统级架构。本文将说明GaAs,硅和无源集成电路技术的适当应用。给出一个摘要,突出显示了迄今为止每种技术的相对优势和劣势。

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