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首页> 外文期刊>IEEE Journal of Solid-State Circuits >A 3.1 GHz–8.0 GHz Single-Chip Transceiver for MB-OFDM UWB in 0.18-$mu$ m CMOS Process
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A 3.1 GHz–8.0 GHz Single-Chip Transceiver for MB-OFDM UWB in 0.18-$mu$ m CMOS Process

机译:用于MB-OFDM UWB的3.1 GHz–8.0 GHz单芯片收发器,采用0.18-μmCMOS工艺

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摘要

This paper presents the design and integration of a fully-integrated dual-conversion zero-IF2 CMOS transceiver for 9-band MB-OFDM UWB systems from 3.1 GHz to 8.0 GHz. The transceiver integrates all building blocks including a variable-gain wideband LNA, a single combined mixer for both RF down-conversion in RX and up-conversion in TX, a fast-settling frequency synthesizer, and IQ ADCs and DACs. Fabricated in a standard 0.18- $mu$m CMOS process, the receiver measures maximum S11 of ${-}$ 13 dB, maximum NF of 8.25 dB, in-band IIP3 of better than ${-}$13.7 dBm, and variable gain from 25.3 to 84.0 dB. IQ path gain and phase mismatches of the receiver chain are measured to be 0.8 dB and 4 $^{circ}$, respectively. The transmitter achieves a minimum output P–1 dB of ${-}$8.2 dBm, sideband rejection of better than ${-}$42.2 dBc, and LO leakage of smaller than ${-}$ 46.5 dBc.
机译:本文介绍了用于3.1 GHz至8.0 GHz的9频段MB-OFDM UWB系统的完全集成的双转换零IF2 CMOS收发器的设计和集成。该收发器集成了所有构建模块,包括可变增益宽带LNA,用于RX中的RF下变频和TX中的上变频的单个组合混频器,快速建立频率合成器以及IQ ADC和DAC。接收器采用标准的0.18-μmCMOS工艺制造,最大S11为$ {-} $ 13 dB,最大NF为8.25 dB,带内IIP3优于$ {-} $ 13.7 dBm,并且可变增益25.3至84.0 dB接收器链的IQ路径增益和相位失配分别测得为0.8 dB和4。发射器的最小输出P-1 dB为$ {-} $ 8.2 dBm,边带抑制优于$ {-} $ 42.2 dBc,LO泄漏小于$ {-} $ 46.5 dBc。

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