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首页> 外文期刊>Solid-State Circuits, IEEE Journal of >Performance Limits, Design and Implementation of mm-Wave SiGe HBT Class-E and Stacked Class-E Power Amplifiers
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Performance Limits, Design and Implementation of mm-Wave SiGe HBT Class-E and Stacked Class-E Power Amplifiers

机译:毫米波SiGe HBT E类和堆叠E类功率放大器的性能极限,设计和实现

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摘要

Design equations and performance limits of Class-E power amplifiers at mm-waves, including the limitations imposed by active and passive devices in a given technology, are presented in this paper. A beyond nominal breakdown voltage Class-E design methodology for SiGe HBT power amplifiers is proposed to generate high output power while maintaining high Class-E efficiency. A mm-wave SiGe stacked Class-E architecture is also introduced to increase the overall voltage swing, with each series stacked device operating in the beyond nominal breakdown mode. The mm-wave beyond $BV_{rm CEO}$ operation of SiGe HBTs has been demonstrated experimentally in an integrated 45 GHz Class-E power amplifier fabricated in a 0.13 µm SiGe BiCMOS process with 20 dBm measured output power at 31.5% peak power-added efficiency (PAE). The series stacking of mm-wave Class-E power amplifier concept is also verified by fabricating double-stacked and triple-stacked SiGe HBT power amplifiers in 0.13 µm SiGe BiCMOS process which demonstrate a measured output power of 23.4 dBm at 41 GHz with peak PAE of 34.9%. High power, highly efficient, switching power amplifier unit cells presented in this paper can facilitate realization of efficient Watt-level mm-wave digital polar transmitters.
机译:本文介绍了毫米波下E类功率放大器的设计方程式和性能极限,包括给定技术中有源和无源器件施加的限制。提出了一种用于SiGe HBT功率放大器的超出额定击穿电压的E类设计方法,以产生高输出功率,同时保持E类效率。还引入了毫米波SiGe堆叠E类架构,以增加总体电压摆幅,每个串联堆叠器件均以超出正常击穿模式的方式工作。 SiGe HBT的 $ BV_ {rm CEO} $ 操作之外的毫米波已在集成的45 GHz类中进行了实验证明-E功率放大器,采用0.13 µm SiGe BiCMOS工艺制造,测得的输出功率为20 dBm,峰值功率附加效率(PAE)为31.5%。毫米波E类功率放大器概念的系列堆叠还通过在0.13 µm SiGe BiCMOS工艺中制造双堆叠和三堆叠SiGe HBT功率放大器进行了验证,该放大器在41 GHz时具有23.4 dBm的测量输出功率,峰值PAE占34.9%。本文提出的高功率,高效率,开关功率放大器单位单元可以帮助实现高效的瓦特级毫米波数字极性发射机。

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