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Carrizo: A High Performance, Energy Efficient 28 nm APU

机译:Carrizo:高性能,节能28 nm APU

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摘要

AMD's 6th generation “Carrizo” APU, targeted at 12–35 W mobile computing form factors, contains 3.1 billion transistors, occupies 250.04 mm and is implemented in a 28 nm HKMG planar dual-oxide FET technology with 12 metal layers. The design achieves a 29% improvement in transistor density compared to the 5th generation “Kaveri” APU, also a 28 nm design, and implements several power management features resulting in area and power improvements similar to a technology shrink. Increased power density makes meeting the thermal limits required for reliability and power distribution to the APU's processors substantial design challenges. Pre-silicon thermal analysis is used to understand and take advantage of thermal gradients. Adaptive voltage-frequency scaling in the processor core as well as wordline and bitline assist techniques in the L2 cache enable lower minimum voltage requirements.
机译:AMD的第六代“ Carrizo” APU面向12-35 W移动计算尺寸,包含31亿个晶体管,占地250.04毫米,并采用具有12个金属层的28 nm HKMG平面双氧化物FET技术实现。与第五代“ Kaveri” APU(也是28 nm设计)相比,该设计将晶体管密度提高了29%,并实现了多种电源管理功能,从而导致了面积和功耗的改善,类似于技术上的缩减。功率密度的增加使得要满足APU处理器的可靠性和功率分配所需要的散热极限,这是严峻的设计挑战。硅前热分析用于了解和利用热梯度。处理器内核中的自适应电压频率缩放以及L2缓存中的字线和位线辅助技术可实现较低的最低电压要求。

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