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Fabrication of monocrystalline 3C-SiC resonators for MHz frequency sensors applications

机译:用于MHz频率传感器应用的单晶3C-SiC谐振器的制造

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摘要

Modern microelectronics and micromachining are based on crystalline silicon. The increasing demand for sensors able to operate in harsh environment, as temperature above 300 ℃, high pressures, intense vibrations or corrosive liquids, has stimulated the research for alternatives to silicon. Particularly due to its superior electrical, mechanical and chemical properties, silicon carbide is a material that has attracted much attention. Some tentative of MEMS fabrication with polycrystalline or amorphous SiC have been already carried out in past but high stress in the layers and low electrical efficiency have been obtained. In this work single crystal SiC based resonators able to work at high frequencies with high quality factors have been successfully fabricated and tested. Using a novel surface micromachining process with improved CVD grown 3C-SiC layers, we have obtained suspended structure thicknesses higher than 1 μm and with vertical sidewalls clearly defined. Preliminary characterization results based on direct observation of the cantilevers resonance have shown that the resonance frequencies of these structures are 50% higher than those of equivalent Si devices. This is particularly interesting for high sensing applications. In addition, the quality factor is also increased by more than 100%, when compared with the Si counterpart. Many devices were resonated at frequencies superior to 1 MHz and the future objective will be to obtain superior frequencies with nano-devices.
机译:现代微电子学和微机械加工均基于晶体硅。随着温度超过300℃,高压,强烈的振动或腐蚀性液体,对能够在恶劣环境下运行的传感器的需求不断增长,这刺激了人们对硅替代品的研究。特别是由于碳化硅具有优越的电气,机械和化学性能,它是一种备受关注的材料。过去已经进行了一些使用多晶或非晶SiC制造MEMS的尝试,但是层中的应力很高且电效率较低。在这项工作中,已经成功地制造和测试了能够以高质量因子在高频下工作的基于SiC的单晶谐振器。使用具有改进的CVD生长的3C-SiC层的新型表面微加工工艺,我们获得了高于1μm的悬浮结构厚度,并且明确定义了垂直侧壁。基于对悬臂梁共振的直接观察的初步表征结果表明,这些结构的共振频率比等效Si器件的共振频率高50%。这对于高感测应用特别有趣。此外,与硅产品相比,品质因数也提高了100%以上。许多设备在高于1 MHz的频率下产生谐振,未来的目标将是通过纳米设备获得更高的频率。

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