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'Semi-insulating' silicon using deep level impurity doping: problems and potential

机译:使用深层杂质掺杂的“半绝缘”硅:问题和潜力

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The possibility of using deep level impurities to obtain 'semi-insulating' Czochralski silicon of near-intrinsic resistivity for microwave applications has been analysed. It is shown that co-doping with a deep donor and deep acceptor is effective in producing high resistivity p-type silicon if a single sufficiently deep donor is not available. Values of deep impurity levels and their concentrations ideally suited for the purpose have been evaluated. It is found that there is a trade-off between control over deep impurity doping concentration and the maximum achievable resistivity. Calculations of resistivity using published data for a number of transition metal impurities such as Au, Ag, Cr, Co, Pd, Pt, V and Mn show that V and Mn are best suited to achieve the goal if Au and Ag are disqualified due to high diffusivity. A comparison of Si:Mn with semi-insulating GaAs:Cr shows the limitations of the effectiveness of deep level doping in silicon.
机译:已经分析了使用深层杂质获得具有近本征电阻率的“半绝缘”直拉硅的微波应用的可能性。结果表明,如果没有足够深的供体,则用深施主和深受主共掺杂可有效生产高电阻率的p型硅。已评估了深杂质水平及其理想的浓度值。发现在控制深杂质掺杂浓度与最大可达到的电阻率之间存在折衷。使用公开的数据对许多过渡金属杂质(例如Au,Ag,Cr,Co,Pd,Pt,V和Mn)进行电阻率计算,结果表明,如果由于以下原因使Au和Ag不合格,则V和Mn最适合实现这一目标:高扩散性。 Si:Mn与半绝缘GaAs:Cr的比较显示了硅深能级掺杂有效性的局限性。

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