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Contact block reduction method and its application to a 10 nm MOSFET device

机译:接触块减少方法及其在10 nm MOSFET器件中的应用

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With the scaling of semiconductor devices to nano-size dimensions, gate lengths reach their physical limits of 8-15 nm. In such devices, a variety of undesirable effects begin to be prominent, including gate leakage, discrete impurity effects and source-to-drain tunnelling. To address the issue of source-to-drain tunnelling we apply to a prototypical 10 nm MOSFET device a novel highly efficient method, termed contact block reduction (CBR) method. It has been reported recently that the CBR method allows us to calculate the ballistic current (transmission function) through an arbitrarily shaped, multi-terminal two- or three-dimensional device. Here we show that in the ballistic case the density matrix of the open device can be computed using the same method. This opens a possibility for an efficient fully quantum-mechanical self-consistent calculation within the ballistic limit.
机译:随着半导体器件缩放到纳米尺寸,栅极长度达到其8-15 nm的物理极限。在这样的器件中,各种不良影响开始显着,包括栅极泄漏,离散杂质影响和源漏隧道效应。为了解决源极到漏极隧穿的问题,我们将一种典型的新型高效方法(称为接触阻滞减少(CBR)方法)应用于一种典型的10 nm MOSFET器件。最近有报道说,CBR方法允许我们通过任意形状的多端子二维或三维设备计算弹道电流(传递函数)。在这里,我们表明,在弹道情况下,可以使用相同的方法来计算打开设备的密度矩阵。这为在弹道极限内进行高效的完全量子力学自洽计算提供了可能性。

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