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Charge distribution and vertical electron transport through GaN/AlN/GaN single-barrier structures

机译:通过GaN / AlN / GaN单势垒结构的电荷分布和垂直电子传输

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摘要

We investigate the charge distribution and vertical electron transport through GaN/AlN/GaN single-barrier structures with different AlN thickness. The results of electrical characterization are interpreted by comparison with simulations of the electronic structure using a self-consistent Schroedinger-Poisson equation solver. Capacitive measurements confirm the formation of a two-dimensional electron gas at the bottom interface of the AlN barrier, even for barrier thickness of 0.5 nm. Conductive atomic force microscopy reveals that the current flow concentrates at discrete locations whose density is in the 10~7 cm~(-2) range, more than one order of magnitude lower than the dislocation density in these samples.
机译:我们研究了具有不同AlN厚度的GaN / AlN / GaN单势垒结构的电荷分布和垂直电子传输。通过使用自洽的Schroedinger-Poisson方程求解器与电子结构的仿真进行比较,可以解释电表征的结果。电容测量证实即使在厚度为0.5 nm的情况下,在AlN势垒底部界面处也会形成二维电子气。导电原子力显微镜显示,电流集中在离散位置,其密度在10〜7 cm〜(-2)范围内,比这些样品中的位错密度低一个数量级。

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