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Reduced microwave attenuation in coplanar waveguides using deep level impurity compensated Czochralski-silicon substrates

机译:使用深水平杂质补偿的直拉硅衬底降低共面波导中的微波衰减

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摘要

We show that deep level doping of Czochralski-grown silicon wafers is capable of providing high resistivity handle wafers suitable for radio frequency integrated circuits. Starting from n-type Czochralski silicon wafers having a nominal resistivity of 50 Ω cm, we use ion implantation and subsequent annealing to increase the resistivity of the wafers to over 10 kΩ cm at room temperature. Coplanar waveguides fabricated on implanted wafers show strongly reduced attenuation down to 0.3 dB mm~(-1) from 0.8 dB mm~(-1) for un-implanted wafers in the 1-40 GHz range, providing clear evidence that the technique is effective in improving performance of passive devices at GHz range frequencies.
机译:我们表明,Czochralski生长的硅晶片的深层掺杂能够提供适用于射频集成电路的高电阻率处理晶片。从标称电阻率为50Ωcm的n型Czochralski硅晶片开始,我们使用离子注入和随后的退火工艺将晶片的电阻率在室温下提高到10kΩcm以上。在1-40 GHz范围内的未植入晶圆上,在植入晶圆上制造的共面波导显示出从0.8 dB mm〜(-1)到0.3 dB mm〜(-1)的衰减,大大降低,这清楚地证明了该技术是有效的改善无源设备在GHz范围频率下的性能。

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  • 来源
    《Semiconductor science and technology》 |2011年第7期|p.1-4|共4页
  • 作者单位

    School of Electronics and Computer Science, University of Southampton, Southampton SO 17 1BJ, UK;

    School of Electronics and Computer Science, University of Southampton, Southampton SO 17 1BJ, UK,Department of Materials, University of Oxford, Oxford OX1 3PH, UK;

    School of Electronics and Computer Science, University of Southampton, Southampton SO 17 1BJ, UK;

    Department of Materials, University of Oxford, Oxford OX1 3PH, UK;

    Department of Materials, University of Oxford, Oxford OX1 3PH, UK;

    Department of Materials, University of Oxford, Oxford OX1 3PH, UK,MEMC Electronic Materials SpA, Viale Gherzi 31, 28100 Novara, Italy;

    School of Electronics and Computer Science, University of Southampton, Southampton SO 17 1BJ, UK;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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  • 入库时间 2022-08-18 01:31:23

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