Trends in Wafer Cleaning

摘要

Requirements of more stringent device specifications, environmental concerns and the move to new materials are prompting the development of dry cleaning techniques such as laser, aerosols and ozonated chemistries in parallel with the improvement of wet methods. The move to new materials is also forcing the advancement of new cleaning solutions. Standard chemistries for aluminum do not work for copper, and at 0.13 μm design rules, the transition to low k materials with dielectric constants in the 2.5 to 2.8 range bring additional challenges.