Advanced Materials for Optoelectronic Packaging

摘要

What are the new and advanced packaging materials available for optoelectronics and MOEMS/MEMS? Materials impact performance, reliability, weight, manufacturability and cost. A variety of new advanced composite and monolithic materials are now available that provide great advantages over those traditionally used in microelectronic, optoelectronic, micro-op-to-electro-mechanical (MOEMS) and micro-electro-mechanical (MEMS) packaging, including: 1. Thermal conductivities ranging from extremely high thermal (up to more than 4 x that of copper) to extremely low. 2. Tailorable coefficients of thermal expansion (CTEs) from -2 to +60 ppm/K. 3. Electrical resistivities ranging from very low to very high. 4. Extremely high strengths and stiffnesses. 5. Low densities.