System Provides Interior Packaging Deformation

摘要

Traditionally, Moire technology has been used to measure packaging strain. A disadvantage for in-plane deformation measurement is that Moire requires a grating be adhered to the sample, to produce fringe patterns for measuring in-plane deformation. Other ― Moire and non-Moire ― systems allow the accurate external measurement of out-of-plane package deformation (warpage), using the projection of two gratings (shadow Moire) or by measuring the height of the package's four corners relative to the center.