Many methods for stacking die have been employed in the name of miniturizadon, especially for mobile applications. Stacked package arrangements give the advantage of assembling die that have been tested and burned-in as packaged devices. Tessera (San Jose) has been developing a new contact for its stackable package to reduce its height. Some of the details of this microcontact array technology were revealed in a paper presented at this year's SMTA International Conference.
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