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New Materials in Semiconductor Fabrication: An Evolutionary Process

机译:半导体制造中的新材料:进化过程

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An evolution has been taking place in CMOS fabrication processes, which received an injection of pace when Intel (Santa Clara, Calif.) and IBM (Yorktown Heights, N.Y.) both announced the use of hafnium in the high-k dielectric gate material. It is becoming clear that novel materials are going to play an important role in sustaining Moore's Law, along with the traditional scaling. The voracious appetite for rapidly storing and accessing information has prompted the need for materials with higher and higher k values, ranging from the oxides of aluminum to rare earth metals and those of every possible element in between. The challenges are enormous, as the novel molecules to make it all happen show some very unusual properties that make their transport onto the wafer more difficult and their breakdown chemistries much more complex.
机译:CMOS制造工艺正在发生发展,当英特尔(加利福尼亚州圣克拉拉)和IBM(纽约州约克敦高地)都宣布在高k介电栅极材料中使用use时,CMOS制造工艺得到了飞速发展。越来越明显的是,新颖的材料将在维持摩尔定律以及传统的缩放比例方面发挥重要作用。快速存储和访问信息的狂热欲望促使人们需要具有越来越高的k值的材料,范围从铝的氧化物到稀土金属以及介于两者之间的所有可能元素的氧化物。挑战是巨大的,因为要使其全部实现的新型分子显示出一些非常不寻常的特性,这使其在晶片上的运输更加困难,并且其分解化学也更加复杂。

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