The results of the μPILR interconnect and BGA comparison testing demonstrate that an alternative interconnect approach, such as the μPILR copper contacts, may achieve an increase in characteristic life over conventional lead-free BGA interconnections in both drop testing and thermal cycle testing. It is significant to note that the results were achieved with a nickel-gold finish on the substrate pads and SAC 305 solder. Even better drop test results may be achieved by using alternate μPILR. contact finishes and solder alloys, e.g., copper with OSP and lower silver content alloy. For this reason, the μPILR PoP offers a wider process window in terms of interconnect materials, which can result in greater flexibility within the SMT supply chain and assembly process.
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