Application of Simulation Technology to the Development of High-Speed Electronics

摘要

As the signal processing speed of electronic devices increases, transmission capability over 10 Gbps has been required for printed wiring boards. As electronic equipment has reduced in size and advanced in processing speed, the heat density of such equipment has increased. As high accuracy is required for the integrity of several Gbps signals, we have combined the three-dimensional electromagnetic-field simulation with the signal integrity simulation. In the thermal simulations, we have increased the accuracy of the simulation by external environment reproduction, transient simulation and the modeling of the copper patterns for printed wiring boards. Thus, we have built the optimal solution that meets the product specification. This paper describes the latest simulation technologies (signal integrity, EMC, three-dimensional electromagnetic-field analysis, and thermal simulation) along with some examples of product designs.