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High thermal conductivity in cubic boron arsenide crystals

机译:立方砷化硼晶体中的高导热性

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摘要

The high density of heat generated in power electronics and optoelectronic devices is a critical bottleneck in their application. New materials with high thermal conductivity are needed to effectively dissipate heat and thereby enable enhanced performance of power controls, solid-state lighting, communication, and security systems. We report the experimental discovery of high thermal conductivity at room temperature in cubic boron arsenide (BAs) grown through a modified chemical vapor transport technique. The thermal conductivity of BAs, 1000 +/- 90 watts per meter per kelvin meter-kelvin, is higher than that of silicon carbide by a factor of 3 and is surpassed only by diamond and the basal-plane value of graphite. This work shows that BAs represents a class of ultrahigh thermal conductivity materials predicted by a recent theory, and that it may constitute a useful thermal management material for high-power density electronic devices.
机译:电力电子和光电设备中产生的高热量密度是其应用中的关键瓶颈。需要具有高导热率的新材料来有效地散热,从而增强电源控制,固态照明,通信和安全系统的性能。我们报告了通过改良的化学气相传输技术生长的立方砷化硼(BAs)在室温下具有高导热率的实验发现。 BA的热导率为每米每开尔文每米1000 +/- 90瓦,比碳化硅的热导率高3倍,并且仅金刚石和石墨的基面值就超过了。这项工作表明,BAs代表了最新理论预测的一类超高热导率材料,并且它可能构成用于高功率密度电子设备的有用的热管理材料。

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  • 来源
    《Science》 |2018年第6402期|579-581|共3页
  • 作者单位

    Univ Texas Dallas, Dept Phys, Richardson, TX 75080 USA;

    Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA;

    Univ Illinois, Dept Phys, Urbana, IL 61801 USA;

    Univ Texas Dallas, Dept Phys, Richardson, TX 75080 USA;

    Univ Houston, Dept Chem, Houston, TX 77204 USA;

    Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA;

    Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA;

    Univ Texas Dallas, Dept Phys, Richardson, TX 75080 USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);美国《化学文摘》(CA);
  • 原文格式 PDF
  • 正文语种 eng
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