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Effect of Crack Length on Strength Recovery of Silicon-Carbide-Whisker-Reinforced Silicon Nitride Upon Healing Treatment

机译:裂纹长度对愈合处理时碳化硅晶须增强氮化硅强度恢复的影响

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摘要

A silicon carbide whisker (SiCw) reinforced silicon nitride (Si3N4) composite ceramic was selected to study the crack-healing performance. Pre-cracks of various length were introduced on the tensile side of specimens by Vickers hardness tester. The crack-healing performance as a function of heating temperature and crack dimension, as well as the crack-healing mechanism were investigated. The optimal heat treatment temperature for crack-healing of Si3N4/SiCw is 1200-1300 degrees C. The treatment allows complete healing of a crack of 200 mu m after heat treated at 1300 degrees C, and achievement of a substantial strength recovery for pre-cracked specimens even with much longer cracks (1200 mu m). Crack closure and strength recovery of the pre-cracked specimen were considered to be triggered by the creation of SiO2, liquid aluminosilicate glass and silicon yttrium oxide by the oxidation reaction as filling mechanism during heat treatment.
机译:选择了碳化硅晶须(SiCw)增强氮化硅(Si3N4)复合陶瓷来研究裂纹修复性能。用维氏硬度计将不同长度的预裂纹引入试样的拉伸侧。研究了裂纹愈合性能随加热温度和裂纹尺寸的变化以及裂纹愈合机理。用于Si3N4 / SiCw裂纹修复的最佳热处理温度为1200-1300摄氏度。该处理可以在1300摄氏度的热处理后完全治愈200微米的裂纹,并实现相当大的强度恢复,从而达到开裂的试样甚至具有更长的裂缝(1200微米)。预裂纹的裂纹闭合和强度恢复被认为是由热处理过程中作为填充机理的氧化反应生成的SiO2,液态铝硅酸盐玻璃和氧化钇硅引发的。

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