Stiffness optimization of flexible PCB electrical dynamic links

摘要

Lithographic apparatuses comprise a base frame (BF), which is generally subject to large excitations, for example due to scanning stages that move with respect to the base frame. There is, however, also a demand for tight overlay specifications, which require that certain critical modules of the apparatus, such as the Projection Optics Box (POB), the Illuminator and the Wafer Stage Metrology Frame are isolated from the base frame, in order to avoid the transmission of vibrations.