LITHOGRAPHIC APPARATUS, SUBSTRATE TABLE, AND MANUFACTURING METHOD

摘要

Accordingly, it is desirable to develop structures and methods for substrate tables that allow increased wear resistance and frictional properties. In some embodiments, a method comprises treating a burled surface of an object using radiation or heat. The method further comprises setting parameters of the radiation or heat to effectuate a predetermined surface strength, hardness, roughness, coefficient of friction, chemical resistance, wear resistance, and/or corrosion of the burled surface. In some embodiments, a support table comprises a burled surface. The burled surface comprises a contact layer configured to be treated to effectuate a predetermined surface strength, hardness, roughness, coefficient of friction, chemical resistance, wear resistance, and/or corrosion of the contact layer. The contact layer has been treated based on exposure to a beam of radiation or exposure to heat such that a parameter of the contact layer is greater than a same parameter of a reference layer having a same construction as the contact layer but without exposure to the beam of radiation or heat. In some embodiments, a lithographic apparatus comprises an illumination system, a projection system, and a support table. The support table comprises a burled surface. The burled surface comprises a contact layer configured to be treated to effectuate a predetermined surface strength, hardness, roughness, coefficient of friction, chemical resistance, wear resistance, and/or corrosion of the contact layer. The contact layer has been treated based on exposure to a beam of radiation or exposure to heat such that a parameter of the contact layer is greater than a same parameter of a reference layer having a same construction as the contact layer but without exposure to the beam of radiation or heat. The illumination system is configured to illuminate a pattern of a patterning device. The projection system is configured to project an image of the pattern onto a substrate. Further features of the present disclosure, as well as the structure and operation of various embodiments, are described in detail below with reference to the accompanying drawings. It is noted that the present disclosure is not limited to the specific embodiments described herein.