高熱伝導性有機材料を用いた電子部品・パワー素子の放熱部材の開発

摘要

高熱伝導性を有する有機繊維を用いた放熱材料の検討として，PBO繊維クロスを用いた放熱シートおよび基板を試作し，その基礎特性を把握するとともに，電流可変チョッパ制御装置のIGBTモジュールーヒートシンク間を放熱シートにより取り付けた場合の温度特性を測定した結果，以下のような知見が得られた。%Radiation of heat generating from electronic parts has now become a significant issue along with achievement of downsizing, densification and high efficiency of the electronic equipment. To cope with this issue, high thermal conductivity greases and electronic boards making use of high heat conduction ceramic and carbon have been developed. We have paid attention to an organic fiber which has high thermal conductivity in a fiber direction. We have fabricated and tested heat radiation sheets and boards using a high thermal conductivity organic fiber for electronic components and power devices. Further we have tested the heat radiating property of this heat radiation sheet which is inserted between IGBT modules and a heat sink in a chopper device.