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Thick film techniques for hybrid integrated microwave circuits

机译:混合集成微波电路的厚膜技术

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摘要

The applicability of thick film technique has been investigated for frequencies above 1 GHz. By usinga special technique (direct metal foil screens) integrated microwave circuits for frequencies up to 10 GHz have been fabricated. The special requirements for microwave thick film circuits are discussed and the electrical and technological properties of three selected microwave circuits are reported in detail.
机译:已经对高于1 GHz的频率研究了厚膜技术的适用性。通过使用特殊技术(直接金属箔屏),已制造出频率高达10 GHz的集成微波电路。讨论了对微波厚膜电路的特殊要求,并详细报告了所选择的三种微波电路的电气和技术特性。

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