Infrared focal plane array storage life assessment by accelerated aging

摘要

To satisfy the need for characterizing the aging process of infrared focal plane arrays (FPAs) in storage, tests were performed where FPAs wee subjected to four different stress temperatures. A Weibull distribution which was fitted to the pixel failure data indicated a shape parameter of 0.97. an Arrhenius analysis showed that an activation energy of 0.76 eV is driving the aging process. Once such a device-specific degradation was characterized, a lifetime was projected for the FPA.