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Big Improvements For Small Parts

机译:小零件的重大改进

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Headquartered in Silicon Valley, CA, National Semiconductor Corp, supplies several companies with microcircuits, also known as microchips, which process massive amounts of signals into digital information., Microcircuits are inside all electronic devices, such as personal digital assistants, laptop computers and automotive controls They are made by processing wafers consisting mostly of silicon through many fabrication steps, such as oxidation and photomasking to define the circuit layout, and ion implantation and diffusion to define the transistor. When the wafers have completed the fabrication steps, they are diced into "chips," assembled into the final package and shipped to customers, who use them in assembling their end products. The fabrication process--from taw silicon to a packaged integrated circuit (1C)--involves more than 200 steps on 75 pieces of equipment. Processes involve epitaxial growth, ion implantation, photolithography, photomasking, diffusion, oxidation and chemical and physical vapor deposition. Many of these steps take place in class one clean rooms, meaning no more than one particle of dust greater than 0,5 micrometers is allowed per cubic foot of air.
机译:美国国家半导体公司总部位于加利福尼亚州硅谷,为多家公司提供微电路(也称为微芯片),这些微电路将大量信号处理为数字信息。微电路存在于所有电子设备内部,例如个人数字助理,笔记本电脑和汽车控制它们是通过许多制造步骤来处理主要由硅组成的晶圆而制成的,例如通过氧化和光掩膜来定义电路布局,以及通过离子注入和扩散来定义晶体管。晶圆完成制造步骤后,将其切成小片,组装成最终包装并运送给客户,客户将其用于组装最终产品。从拉晶硅到封装集成电路(1C)的制造过程涉及75台设备的200多个步骤。工艺包括外延生长,离子注入,光刻,光掩膜,扩散,氧化以及化学和物理气相沉积。这些步骤中的许多步骤是在一级洁净室中进行的,这意味着每立方英尺的空气最多只能有一个大于0.5微米的灰尘颗粒。

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