ADVANTAGES OF & PASSIVE COOLING LAMINAR AIRFLOW

摘要

With microprocessor technology heating up the manufacturing industry, heat dissipation is becoming the new rocket science. Unfortunately, many commercially available heat sinks are poor substitutes for a quality heat exchanger. Microprocessor heat sinks may be adequate in applications where you need only dissipate 30 W. But what if you need to dissipate 250 W? Or 2,400 W? With 100 percent reliability? All silicon devices experience a forward-conducting voltage drop of roughly 0.5 to 2 V across the semiconductor device. If not for this forward voltage drop, you would not have any heat to exchange. For microprocessors running low amperes, the heat can be discarded relatively easily. But, what about power silicon applications? Thyristors switching and controlling hundreds of amps at 480 V or higher can generate serious heat that must be exchanged reliably. It will certainly take more than an off-the-shelf heat sink to accomplish that task.