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机译:低功耗5 GHz RF前端的芯片封装代码
IMEC, Leuven;
MMIC; band-pass filters; cordless telephone systems; integrated circuit design; integrated circuit packaging; low-power electronics; microwave filters; multichip modules; transceivers; voltage-controlled oscillators; wireless LAN; 5 GHz; DECT; RF bandpass filters; RF front end; WLANs; chip-package codesign; low-power implementation; multilayer structure; single-package integration; system-on-a-package; thin-film multichip module; transceiver solutions; voltage-controlled oscillator;
机译:高性能DSP的最佳芯片封装协同设计
机译:用于5 GHz频带低功率RF-IC和静态随机存取存储器应用的低泄漏0.10μm互补金属氧化物半导体性能的尺寸效应分析
机译:用于WLAN应用的低功耗5 GHz CMOS RF接收器
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机译:高性能DSP的最佳芯片封装代码