Trends in Microvia Technology

摘要

Much has happened since the first direct-chip-attach product using the IBM Surface Laminar Circuit (SLC) technology was first shipped from the company's Yasu, Japan, facility in 1992. The technology has found widespread application in a variety of products, from product boards to integrated circuit (IC) packages. Since this time, a variety of methods to produce high-density boards have been investigated and commercialized.