The Package Routing Challenge

摘要

Additional consideration must be placed on the auxiliary power delivery circuits such as in PLL and reference power delivery routing, if present. Always check to see that the ball-out position of these critical circuits provides . adequate access for a straightforward PCB layout routing to external filter components and reference supplies. For fine-pitch BGAs with land pitch <= 1.0 mm this usually means a ball assignment along the outer perimeter of the solder ball array. Successful IC package design occurs when the physical interconnect requirements engineered in the signal and power characterization effort are closely followed by an efficient physical design strategy. With the advances in today's deep-submicron ICs, your package design and routing strategy is more critical than ever.