机译:基于MILP的具有受限路由结构的2层球栅阵列封装的高效路由方法
Department of Communications and Integrated Systems, Tokyo Institute of Technology, Tokyo, 152-8552 Japan;
Department of Communications and Integrated Systems, Tokyo Institute of Technology, Tokyo, 152-8552 Japan Nippon Life Insurance Company;
School of Computer Science and Engineering, the University of Aizu, Aizuwakamatsu-shi, 965-8580 Japan;
Division of Electrical, Electronic and Information Engineering, Osaka University, Suita-shi, 565-0871 Japan;
ball grid array; monotonic; nearest via assignment; package routing; radiate;
机译:两层球栅阵列封装的通孔分配和全局布线方法
机译:通过分配和路由实现2层球栅阵列封装的可路由性
机译:通过分配和路由实现2层球栅阵列封装的可路由性
机译:2层球栅阵列封装的全局布线方法
机译:微波和毫米波针栅阵列和球栅阵列封装的开发。
机译:智能电网无线传感器网络中的节能多不相交路径机会节点连接路由协议
机译:基于MILP的高效路由方法,具有2层球网格阵列包装的限制路径结构
机译:2d(二维) - 1下界2层敲击 - 膝关节通道路由。