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A global routing method for 2-layer ball grid array packages

机译:2层球栅阵列封装的全局布线方法

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In current VLSI circuits, there can be hundreds of required I/O pins. BGA(Ball Grid Array) packaging is commonly used to realize the huge number of connections between VLSI and PCB. In this paper, we propose a global routing method for two-layer BGA packages. In our routing model, the global routing for each net is uniquely determined by a via assignment. Our global routing method begins with an initial feasible via assignment and incrementally improves the via assignment to minimize the total wire length and wire congestion. In each iteration, a via assignment is improved by exchanging adjacent two vias, rotating three vias, or by moving vias to their adjacent grids one by one. Our method is a greedy-based heuristic. The algorithm efficiently generates better global routes than initial routes with respect to wire congestion and total wire length.
机译:在当前的VLSI电路中,可能有数百个所需的I / O引脚。 BGA(球栅阵列)封装通常用于实现VLSI与PCB之间的大量连接。在本文中,我们提出了一种用于两层BGA封装的全局路由方法。在我们的路由模型中,每个网络的全局路由由通孔分配唯一确定。我们的全局布线方法从最初可行的通孔分配开始,然后逐步改进通孔分配,以最大程度地减少总导线长度和导线拥塞。在每次迭代中,通过交换相邻的两个过孔,旋转三个过孔或将过孔逐个移动到其相邻的网格,可以改善过孔的分配。我们的方法是基于贪婪的启发式方法。就电线拥塞和电线总长度而言,该算法可以有效地生成比初始路径更好的全局路径。

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