首页> 外文期刊>Printed Circuit Design >Has the Copper Interconnect Hit Its SPEED LIMIT?
【24h】

Has the Copper Interconnect Hit Its SPEED LIMIT?

机译:铜互连是否达到了速度极限?

获取原文
获取原文并翻译 | 示例
           

摘要

Let's get something straight. It's the silicon that does all the work. It's the silicon where the information is processed and stored, and the signals generated. Packaging and interconnects increase the product's size, weight, cost and time-to-market, while decreasing the signal quality. That's it. What a happy thought! Interconnect engineers can't increase system performance; at most, we try to minimize the hit. This fact is never more apparent than in high-speed serial links, where the bandwidth of signals is ever increasing and the interconnect lengths extend across the entire board, even into large backplanes. We are pushing up against practical limits of data rates that can be transmitted over conventional copper interconnects.
机译:让我们弄清楚。硅可以完成所有工作。它是处理和存储信息以及生成信号的硅片。封装和互连增加了产品的尺寸,重量,成本和上市时间,同时降低了信号质量。而已。多么高兴的想法!互连工程师无法提高系统性能。最多,我们会尽量减少点击。在高速串行链路中,信号的带宽不断增加,并且互连长度延伸到整个电路板,甚至进入大型背板,这一事实从未比高速串行链路更为明显。我们正在努力克服可以通过常规铜互连传输的数据速率的实际限制。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号