IR DROP in High-Speed IC Packages and PCBs

摘要

Today's low-voltage, high-current designs require DC IR drop analysis for off-chip power distribution systems in order to optimize end-to-end voltage margins for every device on the distribution. This article will introduce the basics of IR drop analysis, exemplify the significance of IR drop associated with IC packages and PCBs, and demonstrate typical IR drop simulations for the identification of problematic power distributions. As system complexity and operational speeds increase, the power consumption of integrated circuits increases dramatically. Additionally, the IC supply voltage continues to drop with the inevitable scaling of VLSI technology. With the switch to 90 nm technologies from 130 nm technology, supply voltages have shrunk to 1.2 V and below. According to the International Technology Roadmap for Semiconductors, this trend is expected to continue. See FIGURE 1.