THERMAL MANAGEMENT in Advanced Microelectronics

摘要

Thermal management is an increasingly important enabling technology in the development of advanced microelectronic packages and systems. As circuits become more dense and clock rates increase, so do heat fluxes and other thermal demands. These thermal issues are propagated through the electronics consumption chain (chip, module, system, groups of systems, etc.). Historically, thermal solutions have addressed the immediate level of concern (i.e. a manufacturer of a desktop PC worries only about cooling the chips in its enclosure), and there has been little attention given to the impact of local decisions on the next level of assembly. Today, however, evidence is growing that a global thermal management solution strategy can be more effective than a series of localized solutions. This is just one of the changes in diermal management for electronics that is noted in the Thermal Management chapter of the 2007 iNEMI Roadmap. The chapter addresses the need to develop improved cooling technology in terms of heat transfer processes, materials and innovative designs.