Modeling Issues in High-Speed Simulation

摘要

Until recently, designers performing high-speed PCB simulations worried mostly about finding IBIS models for driver and receiver ICs. By the late 1990s, models could easily be downloaded from vendor Web sites, although the quality of the models was a concern. Still, spurred by demands from a knowledgeable user community, IC vendors gradually became better at providing well-tested, ready-to-use IBIS models.rnRecently, the complexities of higher-speed signaling have demanded additional types of models - for not only IC buffers, but also for packages, vias and connectors. This article surveys these new, and sometimes difficult, requirements.