Endicott Interconnect: Filling the Gap

摘要

My conversations with Endicott Interconnect (EI) began in search of details about one of the technologies used in semiconductor packaging prod- ucts (first level package) and printed circuit board (second level package) applications, via fill. EI offers both conductive and non-conductive versions of via fill, employing a number of diverse techniques that are dependent on the product type, specific design and customer requirement.