Plating's Effects on Electronics Assembly

摘要

While electroplated SnPb surface finish exhibits good solderability and is virtually immune to tin whisker growth, a termination plated with pure tin is very likely to spawn tin whiskers, usually in months or years after plating (FIGURE 1). Tin whiskers, being electrically conductive, have been the cause of short-circuit failures.rnRoHS has similarly compelled board fabricators to final finish solder pads with electroless nickel/immersion gold (ENIG), immersion tin, or immersion silver (since all are Pb-free) instead of the SnPb hot air solder level (HASL) finish used successfully for some 60 years.