Rolling the Packaging Dice

摘要

In early june, almost 900 people gathered in Las Vegas at the Electronic Components and Technology Conference - not necessarily to seek fortunes in the casinos, but to roll the dice on the next big trend in the electronics industry. Bet correctly on the right packaging and assembly trend, and revenues will multiply; bet wrong by installing capacity for a technology not in strong demand, and you could lose it all. Given ASE COO Dr. Tien Wu's prediction of less than double-digit growth on the semiconductor side, the backend packaging and assembly projects to where the action will be.