INEMI Organizes Four Packaging Initiatives

摘要

The International Electronics Manufacturing Initiative (inemi.org) is organizing four new initiatives to address gaps in organic substrate technologies.rnThese initiatives will focus on warpage (understanding the causes of, and establishing methods for measuring), wiring density and holistic modeling.rnThe first proposed initiative is Primary Factors in Warpage. This initiative will focus on gaining a greater understanding of the causes of warpage, particularly in first- and second-level assembly, to better control it. The team will identify key material properties, process parameters, reflow profiles, package pitches, environmental factors and other contributors that impact warpage.